Capability | |
Layer Count | 1-40(≥30 Layers needs Review) |
Board thickness VS drill size | 12:1 |
Line width/spacing | 2.5/3mil |
Min hole size | 0.1mm(laser drilling) |
Surface | HAL/Lesd Free |
ENIG | |
Immersion Tin | |
Immersion Silver | |
OSP |
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